The STM32F103xF and STM32F103xG performance line family incorporates the high-performance ARM?Cortex?-M3 32-bit RISC core operating at a 72 MHz frequency, high-speed embedded memories (Flash memory up to 1 Mbyte and SRAM up to 96 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All devices offer three 12-bit ADCs, ten general-purpose 16-bit timers plus two PWM timers, as well as standard and advanced communication interfaces: up to two I2Cs, three SPIs, two I2Ss, one SDIO, five USARTs, an USB and a CAN. The STM32F103xF/G XL-density performance line family operates in the –40 to +105 °C temperature range, from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications. These features make the STM32F103xF/G high-density performance line microcontroller family suitable for a wide range of applications such as motor drives, application control, medical and handheld equipment, PC and gaming peripherals, GPS platforms, industrial applications, PLCs, inverters, printers, scanners, alarm systems and video intercom.
All features
Core: ARM? 32-bit Cortex?-M3 CPU with MPU
72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access
Single-cycle multiplication and hardware division
Memories
768 Kbytes to 1 Mbyte of Flash memory
96 Kbytes of SRAM
Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories
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